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GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0

GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
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GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
GIGABYTE AORUS Gen4 7000E SSD 1TB – M.2 2280 NVMe 1.4 PCIe 4.0
Model NameGIGABYTE AORUS Gen4 7000E SSD 1TBBrandGIGABYTE / AORUSGeneral SpecificationsForm Factor: M... Read More
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9,999EGP
  • Stock: In Stock
  • Model: AORUS Gen4 7000E SSD 1TB
  • MPN: AG470E1TB
Create unlimited custom product blocks and display them in accordions or tabs or open blocks. Each block can be assigned to all products at once or specific products according to advanced criteria.
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Model Name
GIGABYTE AORUS Gen4 7000E SSD 1TB
Brand
GIGABYTE / AORUS

General Specifications

  • Form Factor: M.2 2280
  • Interface: PCI-Express 4.0 x4, NVMe 1.4
  • Total Capacity: 1TB (1000GB)
  • NAND Flash: 3D TLC NAND
  • External DDR Cache: N/A (DRAM-less architecture utilizing Host Memory Buffer / HMB)

Performance

  • Sequential Read Speed: Up to 7,100 MB/s
  • Sequential Write Speed: Up to 6,100 MB/s
  • TBW (Terabytes Written): 700 TBW
  • MTBF (Mean Time Between Failures): 1.6 million hours

Physical Specifications

  • Dimensions: 22 × 2.3 × 80 mm (Single-sided M.2 design)

Power & Thermal

  • Max. Operating Power: 4.52W (Read) / 4.99W (Write)
  • Operating Temperature: 0°C to 70°C
  • Storage Temperature: -40°C to 85°C

Features & Technologies

  • PCIe 4.0 Interface: Maximizes bandwidth with the NVMe 1.4 protocol, delivering a massive leap in speed over PCIe 3.0 drives.
  • HMB (Host Memory Buffer): Utilizes a portion of the host system's memory to manage the Flash Translation Layer (FTL), maintaining high performance and low latency without the need for a dedicated, power-hungry external DRAM chip.
  • 3D TLC NAND: Provides an excellent balance of high speed, endurance, and reliability for long-term data storage.
  • Single-Sided Design: The ultra-thin 2.3mm single-sided layout ensures maximum compatibility with laptops, PS5 consoles, and motherboards with tight M.2 clearance or pre-installed heatsinks.

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