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Dimensions: 100 × 100 × 3.0 mm; single sheet, pink for easy identification.
Material/performance: Ceramic‑silicone matrix with nano aluminum oxide, delivering high thermal conductivity and high compressibility to conform over uneven surfaces and reduce contact resistance.
Electrical insulation: Dielectric strength 8 kV/mm per ASTM D149, suitable for use around VRMs, memory, SSD controllers, GPU backplates, and other sensitive components.
Hardness: Shore 00‑60, very soft and compliant for effective sealing under low mounting pressure.
Operating temperature: −100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.
Flammability/compliance: UL94 V‑0 flame rating; RoHS compliant.
Typical thermal conductivity: Commonly listed at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.