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Dimensions and format: 100 × 100 × 2.0 mm single sheet; pink for easy identification in assemblies.
Material and performance: Ceramic‑silicone composite filled with nano aluminum oxide, delivering high thermal conductivity with high compressibility to conform over uneven surfaces and reduce contact resistance.
Electrical insulation: Dielectric strength rated 8 kV/mm per ASTM D149, appropriate for VRMs, memory, SSD controllers, GPU backplates, and other sensitive areas.
Hardness: Shore 00‑60, very soft and compliant for effective sealing under low mounting pressure.
Operating temperature: −100°C to +250°C for reliable performance from sub‑zero to sustained high‑heat environments.
Flammability and compliance: UL94 V‑0 flame rating; RoHS compliant materials and production.
Typical conductivity listing: Commonly referenced at 8 W/m·K for Minus Pad 8 series, aligning with the “8” designation.
Use cases: Suited to moderate standoff gaps where 1.0–1.5 mm is insufficient, such as GPU backplates, VRM heatsinks, and console/PC modules with larger tolerances.