Thermalright Heilos 40x50x0.25mm V2 Thermal Interface Pad — 8.5 W/mK Thermal Conductivity, Gray Non-Conductive Silicone Sheet, 0.25mm Thickness, Thermal Resistance 0.04°C·cm²/W, Resistivity 2.1×10¹⁴ Ω·cm, Safe for CPUs & GPUs

General Information

• Type: Solid thermal interface pad (non-adhesive)
• Use Case: Designed for CPU, GPU, memory modules, chipsets, and heatsink applications
• Material: High-quality silicone-based compound with thermally conductive fillers
• Color: Gray
• Form Factor: Pre-cut sheet for easy installation
• Dimensions:
  • Length: 40 mm
  • Width: 50 mm
  • Thickness: 0.25 mm

Thermal Performance

• Thermal Conductivity: 8.5 W/m·K – ensures efficient heat transfer across components
• Thermal Resistance: 0.04 °C·cm²/W – minimizes heat bottleneck between surfaces
• Phase Change Material: Included for improved contact under pressure
• Temperature Stability: Suitable for standard PC operating conditions
• Durability: Long-lasting performance without drying or cracking

Electrical & Safety Features

• Electrical Resistivity: 2.1 × 10¹⁴ Ω·cm – highly non-conductive
• Electrically Safe: Yes – prevents short circuits on PCBs and sensitive electronics
• Corrosion Resistance: Non-corrosive formula – protects surrounding components
• Handling Safety: Harmless to skin and safe for use during system upgrades

Design & Application

• Material Type: Solid thermal pad with phase-change properties – ideal for even pressure distribution
• Installation Method: Drop-in fit – no trimming required for most modern components
• Mounting Pressure: Works best under moderate pressure from cooler brackets or retention clips
• Application Use Cases:
  • CPUs with integrated coolers or aftermarket heatsinks
  • GPUs with backplate cooling or direct-die contact
  • VRM modules, M.2 drives, and chipset heatsinks
• Compatibility:
  • Compatible with DDR5 motherboards and PCIe 5.0 systems
  • Works well in mini-ITX, micro-ATX, and ATX builds